Yitao Huang
Yitao Huang

Yitao Huang

Nanoelectronic & Optoelectronic Devices

I explore how materials, nanoscale architectures, and interfaces can be engineered to control energy, fields, and charge in electronic and optoelectronic devices. My work combines device physics, micro/nanofabrication, multiphysics modeling, and reliability engineering. Building on earlier work in antennas, metamaterials, and resonant structures, I bring a structure-field perspective to nanoscale device design.

Nanoelectronic Optoelectronic Thin-Film Biointegrated
CURRENT RESEARCH

Nanoscale Optoelectronic Devices for Neural Interfaces

Thin-film photovoltaic devices for light-powered neural stimulation and stable operation in physiological environments.

Device Physics & Interfaces

Energy-level alignment, photovoltage generation, charge transport, interfacial recombination, and electrode coupling.

  • Engineer material stacks and interfaces to control charge transport, suppress interfacial losses, and optimize photovoltage generation.

Multiphysics Modeling & Validation

Coupled optical, electrical, electromagnetic, thermal, and neural modeling that bridges device-level energy conversion with tissue-scale response.

  • Model the pathway from optical absorption and carrier generation to electric-field distribution, membrane dynamics, and neural activation.
  • Validate model predictions through electrical characterization and biological experiments across brain-interface platforms.

Micro/Nanofabrication

Low-temperature integration of multilayer inorganic and organic thin films into microscale optoelectronic devices.

  • Develop thin-film deposition, photolithography, and pattern-transfer processes, using AFM, SEM, FIB-SEM, and electrical characterization to identify fabrication- and interface-driven device behavior.

Reliability & Biointerfaces

Encapsulation, barrier engineering, corrosion-resistant contacts, and accelerated aging for long-term operation under physiological conditions.

  • Engineer hybrid inorganic/organic barriers and electrode interfaces, using calcium-test structures and accelerated-aging protocols to identify degradation pathways and improve chronic device stability.
Confocal fluorescence image of retinal tissue layers, with cell nuclei in blue and an immunolabeled signal in red
Confocal image
EARLIER RESEARCH

Electromagnetic Devices & Wave Engineering

My earlier research explored how engineered geometries and electromagnetic structures shape wave propagation, scattering, and radiation. Through computational modeling, physics-based design, and experimental validation, I developed a structure-field perspective that now informs my work on nanoscale electronic and optoelectronic devices.

Tongji University
Shanghai Institute of Intelligent Science and Technologies, Tongji University

Undergraduate Research Assistant · PI: Prof. Meisong Tong

PROJECT LEAD

Radar Cross-Section Control & Metamaterial Absorbers

  • Developed a zone-based scattering framework to identify dominant contributions and guide fuselage and nose shaping, reducing simulated forward RCS by 37% before absorber integration.
  • Designed an X-band double-ring metamaterial absorber achieving >94% absorption, extending the design from geometric shaping to engineered electromagnetic surfaces.
3D rendered model of the redesigned aircraft fuselage and nose structure
Fuselage and nose structure
PROJECT LEAD

Broadband Linear-to-Circular Polarization Conversion

  • Designed broadband C-shaped metasurfaces and developed equivalent-circuit and transmission-line models to interpret their multi-resonant electromagnetic response.
  • Achieved 65% relative bandwidth for linear-to-circular polarization conversion, 25% wider than the reference design.
Schematic of the transmissive C-shaped metasurface polarization converter structure, with layer geometry and dimension labels
Transmissive converter structure

Publications & Patent

A Novel Multiband Fractal Antenna Based on Three-Dimensional Mandelbrot-Set Structure

X. Y. Li, Y. T. Huang, and M. S. Tong

IEEE Open Journal of Antennas and PropagationFeb 2026
Paper →
FIRST AUTHOR
A Novel Broadband Antenna Based on Three-Dimensional Mandelbrot Fractal Geometry

Y. T. Huang, A. Boag, and M. S. Tong

IEEE International Conference on Microwaves, Communications, Antennas, Biomedical Engineering and Electronic Systems (COMCAS)Jul 2024
Paper →
A Novel Broadband Filtering Wilkinson Power Divider with Great Isolation Performance

Z. Sun, Y. T. Huang, M. S. Tong, X. L. Wang, G. Milinevsky, C. P. Chen, and G. Y. Lu

IEEE International Conference on Microwaves, Communications, Antennas, Biomedical Engineering and Electronic Systems (COMCAS)Jul 2024
Paper →
A Novel Design of Microwave Absorbers Based on Multilayered Composite Materials for Reduction of Radar Cross Section

H. Q. Zheng, Y. T. Huang, and M. S. Tong

Applied Computational Electromagnetics Society (ACES) JournalMar 2022
Paper →
FIRST AUTHOR
A Novel Design of X-band Microwave Absorber Based on Metamaterial

Y. T. Huang, X. L. Wu, W. L. He, and M. S. Tong

IEEE International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting (AP-S/URSI)Jul 2022
Paper →
FIRST AUTHOR
A Novel Broadband Linear-to-Circular Polarization Converter Based on Metamaterials

Y. T. Huang, J. F. Wen, and M. S. Tong

IEEE International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting (AP-S/URSI)Jul 2022
Paper →
PATENT
A Reflective Broadband Line-to-Circular Polarization Converter Based on Symmetric C-structured Metamaterial

Y. T. Huang and M. S. Tong

CN216980882UGranted Jul 15, 2022

Education

University of Pennsylvania
University of Pennsylvania

M.S.E. in Electrical Engineering · Philadelphia, PA

  • GPA: 3.97 / 4.0
  • Master's Top GPA Award

Selected coursework: semiconductor devices, nanoelectronics, MEMS/NEMS, integrated photonic systems, quantum technology, and analog/RF integrated circuits.

Tongji University
Tongji University

B.E. in Microelectronics Science and Engineering · Shanghai, China

  • GPA: 88.39 / 100
  • Outstanding Undergraduate Thesis - Sole Recipient (1 of 31)
  • First-Prize Outstanding Student Scholarship

Selected coursework: semiconductor physics and devices, analog/digital integrated circuits, electromagnetic waves, high-frequency circuits, IC layout, microwave engineering, and antenna design.

Industry Experience

Engineering experience spanning R&D infrastructure, device prototyping, circuit design, and system-level validation.

Cahira Technologies
Cahira Technologies, Inc.

Junior Engineer · MIT spinoff · Cambridge, MA

  • Joined as the company's first engineer, establishing R&D workflows and technical infrastructure to translate device concepts into integrated experimental prototypes.
  • Co-developed experimental platforms including customized glovebox, probe-station, and thin-film processing systems, integrating fabrication and characterization capabilities for rapid device iteration.
  • Coordinate technical execution across materials, device engineering, modeling, and biology while serving as Biosafety and Laser Safety Officer and supporting cross-institutional collaboration.
Monolithic Power Systems
Monolithic Power Systems, Inc.

Field Applications Engineer Intern · Shenzhen, China

  • Designed and validated a high-power two-phase buck-converter demo board using a constant-on-time controller and custom parallel current-sharing circuit, achieving 97.1% peak efficiency.
  • Reconstructed and modeled the controller's mixed-signal architecture to analyze loop stability, transient response, current sharing, and system operating limits.
  • Evaluated optical-module architectures and silicon-photonics trends, translating technical findings into system-level analyses for power-electronics applications in optical and semiconductor systems.
Block diagram of the dual-phase buck-converter current-sharing control loop
Current sharing module

Research Capabilities

Experimental and computational capabilities spanning thin-film fabrication, device characterization, multiphysics modeling, and electronic systems.

Micro/Nanofabrication & Thin-Film Processing

Process development and multilayer integration for micro- and nanoscale electronic and optoelectronic devices.

Processes & Tools
SputteringElectron-Beam EvaporationThermal EvaporationALDCVDPhotolithographyRIE

Device Characterization & Interface Analysis

Electrical and optoelectronic characterization, nanoscale morphology and interface analysis, and device-stability evaluation.

Techniques & Tools
AFMSEMFIB-SEMXPSEDS/EDX
Scanning electron microscopy (SEM) image of a device cross-section
SEM image

Multiphysics & Computational Modeling

Physics-based modeling across electronic, optical, electromagnetic, thermal, and coupled device systems.

Platforms
COMSOLLumericalHFSSCSTFEKOMATLAB
Methods
Multiphysics SimulationComputational ElectromagneticsOptical ModelingEquivalent-Circuit ModelingCharacteristic Mode Analysis
Lumerical FDTD field-intensity simulation of a ring resonator coupled to bus waveguides
Lumerical FDTD simulation

Circuits, IC Design & System Prototyping

Analog and mixed-signal IC design, RF/microwave systems, power electronics, PCB development, and hardware prototyping.

Platforms & Tools
CadenceADSLTspiceKiCadVivadoCATIA
Cadence Virtuoso IC layout view
Cadence Virtuoso

Get in Touch

I welcome conversations about nanoelectronic and optoelectronic devices, thin-film and emerging semiconductor systems, as well as PhD research opportunities and collaborations.